With its recently obtained new references, SPS inductive coupling technology solutions gain recognition by ID document manufacturers and issuers on the five continents

March 22, 2019

Smart Packaging Solutions (SPS), a world leader in contactless and dual interface card manufacturing technologies, sees its technologies recognized worldwide by industrialists which benefit from a single process allowing them to deliver all card types and all card bodies for all ID applications.

ROUSSET, FRANCE, March 22, 2019 – Smart Packaging Solutions (SPS) technology, eBoost® inductive coupling, is now widely accepted as demonstrated by its large number of references on the market. These references prove that SPS eBoost® inductive coupling represents the best option for all types of cards, regardless whether they are contactless, hybrid or dual interface. Also, SPS eBoost® inductive coupling makes card manufacturers inherit its intrinsic advantages when it comes to the choice of card body as the process is compatible with all materials used for ID documents: PET, PVC and Polycarbonate. Thanks to the versatility of the technology, issuers have been relying on SPS eBoost® inductive coupling to issue all types of cards: identity cards (compliant or not with IAS standards), driving licenses, agent cards, residence permits and also cards combining multiple functions such as ID and payment.

With SPS eBoost® inductive coupling, card manufacturers use a single technology to satisfy all customer needs. This way manufacturing equipment is better utilized reducing investment amortization cycles and leading to a more profitable activity.

Also, ID projects often vary, either between the launch of the project and its actual execution or even during the project life cycle. Thanks to the use of a single technology able to support all communication standards and all plastic supports, card manufacturers are able to adapt easily to all project evolutions, without any need for additional investment.

The fact that the same manufacturing equipment and the same process are used for all types of cards simplifies logistics. Card vendors enjoy simpler supply chains as they deal with less numerous subcontractors; this reduces their lead times, makes them more flexible, leading to more agility in delivering requested products on the market.

The advantages of SPS eBoost® inductive coupling technology are recognized by multiple projects worldwide:

· In America, Mexico, the local card manufacturer has decided to use SPS eBoost® inductive coupling technology to deliver State Government smart driver’s licenses, made on composite material PET/PVC, with dual interface technology. Thanks to the efficiency of SPS process, the manufacturer needed less than two months from the initial requests to producing the first driving licenses,

· In Africa, the “Ghana Cards,” smart multi-application ID cards, which are issued to Nationals and all legally resident foreigners in Ghana, are based on SPS eBoost® for dual interface cards. In addition to being based on SPS eBoost® inductive coupling technology, they make use of SPS security options, such as CAI™, or Customized Antenna Image that consists in including aluminum etched distinctive signs in the antenna, and CMI™, Customized Module Image that allows having a specific image engraved on the micromodule.

· In Asia, the Maldives, the government had decided to issue dual interface cards combining an identity travel document complying with the ICAO data standards with a MasterCard biometric debit card issued by the Bank of Maldives. These polycarbonate cards use SPS eBoost® inductive coupling technology which enabled the card manufacturer to streamline the manufacturing process and deliver these complex cards in due time,

· In Europe, France, the government agent cards, for the Police and Gendarmerie forces, are based on SPS eBoost® inductive coupling technology that allows to combine a variety of applications on hybrid cards: these polycarbonate cards provide physical access control thanks to their contactless chip and logical access control, authentication and signature using the contact chip.

Dominique Charrie, Marketing Director, ID products, at SPS says: “We’re proud to see our technology recognized by so many governments, card issuers and card manufacturers. This demonstrates that our eBoost® inductive coupling technology brings unprecedented advantages in terms of flexibility, reliability and logistics gains for all players in the ID market segment.”

Smart Packaging Solutions & IN Groupe will be exhibiting on booth D7 at High Security Printing EMEA, a major trade show taking place in Malta on March 25-27, 2019.

About SPS

With the SPS brand, IN Groupe opens its secure components technology to all card and document manufacturers. SPS (Smart Packaging Solutions) is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 140 people. The company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com

Contact

Dominique Charrie, Marketing Director for ID products, SPS, contactsps@s-p-s.com

Phone: +33 4 42 53 88 34

SPS is part of the IN Groupe.

From components to services and from documents to interoperable systems, IN Groupe is a global specialist in identity and secure digital services. The institution plays a daily role in facilitating everyone's life: helping states exercise their sovereignty, citizens protect their identity and businesses preserve their integrity.
Whatever the issue, IN Groupe, a company for digital sovereignty, contributes to asserting a fundamental right for everyone: the right to be you.

Based in Paris, the IN Groupe has two production centers and employs more than 1000 employees, of which over a third is dedicated to technology development.

Contact: IN Groupe

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@ingroupe.com

SPS new thin 150µ S-lam® G2 prelaminate simplifies payment card manufacturing

March 7, 2019

Smart Packaging Solutions (SPS), a world leader in contactless and dual interface card manufacturing technologies, is now introducing 150µm S-Lam® G2, a new generation of prelaminated products that allows card vendors to simplify their manufacturing and logistics process for the production of dual interface and hybrid payment cards.

ROUSSET, FRANCE, March 7, 2019 – Smart Packaging Solutions (SPS) introduces a new generation of its eBoost PAY® inductive coupling technology with the 150µm SLam® G2. With this thinner and innovative prelaminate, payment card vendors are able to simplify their production process as they will be able to manufacture all cards with only one card body structure.

For instance, card manufacturers, in the situation where they are under pressure from their customers to support various assembly technologies and deal with several suppliers for each subpart, can now see their logistics dramatically simplified. As all prelaminates have the same 150µm thickness, card vendors can be certain they will make standard-compliant cards with a single supply of PVC card bodies. This way, they have only one type of PVC inventory to manage, leading to savings in logistics and supply chain costs.

As SPS S-Lam® G2 prelaminates are only 150µm thick, this leaves more space in the 0.76 mm card total thickness to have thicker PVC printed core. As a result, all printing processes will give better results. For instance, silk screen printing will be easier and deliver a better quality on thicker card bodies as there will be no risk of warp or shrinkage.

Finally, the thinner 150µm S-Lam® G2 prelaminates mean less material to transport between SPS factories and the card manufacturer; this not only reduces transportation cost but also decreases the ecological footprint of the whole card manufacturing process.

SPS new S-Lam® G2 is an evolution of SPS S-Lam® inductive coupling offer. As such, it inherits the certifications that were already in place for previous generations of S-Lam®. Card manufacturers evolving from SPS S-Lam® to the new S-Lam® G2 need not to go through any new qualification or certification processes.

Jean-Baptiste Leos, Banking Product Marketing Director at SPS, declares: “At SPS, we care about the industrial process of our customers. With S-Lam® G2, card manufacturers will get an ever improving industrial process that simplifies their logistics, makes printing easier and reduces their transport costs.”

Thanks to a brand new manufacturing process, this SPS new S-Lam® G2 offers the same advantages as the original SPS eBoost PAY® technology based on electromagnetic coupling between the antenna and the module (no physical connection between the chip and the antenna) and allows to increase total manufacturing capacity. SPS eBoost PAY® ensures the cards are significantly more reliable and durable than cards manufactured with other technologies. SPS eBoost PAY® brings card manufacturers a total flexibility as the same process is used to manufacture contact, contactless, dual interface and hybrid payment cards. In addition, these cards can support all distinctive features required by an increasingly sophisticated payment card market: various module sizes, foil, colored edges, metal cards, heavy cards, non-standard formats, and more …

Smart Packaging Solutions will be present during Payments Summit, a major trade show organized by Secure Technology Alliance in Phoenix, AZ, USA on March 11-14, 2019. Do not hesitate to contact us to set up a meeting.

About SPS

Contact

Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com

Phone: +33 4 42 53 84 44

SPS is part of the IN Groupe.

Based in Paris, the IN Groupe has two production centers and employs more than 1000 employees, of which over a third is dedicated to technology development.

Contact: IN Groupe

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@ingroupe.com

SPS introduces anti-skimming function to reassure contactless payment cardholders

November 23, 2018

Smart Packaging Solutions (SPS), a world leader in contactless and dual interface card manufacturing technologies, introduces Press & Pay, a patented, original and validated solution for financial institutions willing to reassure their hesitant customers when switching to contactless and dual interface cards.

ROUSSET, FRANCE, November 23, 2018 – While contactless and dual interface cards meet a growing adoption worldwide, some users are still reluctant to adopt them as they fear card skimming schemes that would threaten their banking card data.

Even if the whole payment industry has repeatedly demonstrated that card skimming is not an issue thanks to the built-in security features in the EMV specifications, some users are still concerned about this issue. To reassure them, SPS introduces Press & Pay, a system that ensures the card contactless communication is only activated when the card is touched by the user’s finger on a given target, and not while it is stored in a wallet or in pants pockets.

The method, patented by SPS, consists in detuning the antenna while the card is at rest and only retuning it when the card is touched by the user’s finger. Actually, the system is triggered just by touching and is not including any biometrics, keeping its cost in line with all issuer requirements for contactless and dual interface banking cards.

Already in 2018, for the first time in history, contactless payment card issuance is likely to reach 1.5 billion units, accounting for more than 50% of all payment card shipments globally,. This move is especially triggered by leading card schemes mandates, that drive the migration to contactless cards in Europe, Asia, Latin America and North America.

Jean-Baptiste Leos, Banking Product Manager at SPS declares: “In the card industry we all know contactless cards are secure, but with Press & Pay, we bring a solution to card issuers who need to reassure their most fearful customers and prove them their card will only be functional when they are willing to pay.”

This performance can only be achieved thanks to SPS inductive coupling technology. As the antenna is not physically connected to the micromodule, it can be detuned and retuned according to the position of a switch, etched at the same time as the antenna. SPS has already delivered over 500 million eBoost® inductive coupling platforms for diverse markets segments worldwide.

Press & Pay technology will be the object of a presentation titled “Press & Pay, the latest SPS innovation” at 15:30, on Wednesday November 28, 2018, during Trustech, a major event for digital trust technologies taking place in Cannes, France, on November 27-29, 2018. Press & Pay will also be demonstrated on SPS booth: RIV F 020.

About Smart Packaging Solutions

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards.

With the SPS brand, IN Groupe opens its secure components technology to all card and document manufacturers.

Located in Rousset, France, with a subsidiary in Singapore, Smart Packaging Solutions employs 180 people. Part of the French IN Groupe, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com
Phone: +33 4 42 53 84 44

SPS is part of the IN Groupe.

A partner of the French government for close to 500 years, IN Groupe offers identity solutions and secure digital services, at the leading edge of technology and integrating electronics and biometrics.
From components to services and from documents to interoperable systems, IN Groupe is a global specialist in identity and secure digital services. The institution plays a daily role in facilitating everyone's life: helping states exercise their sovereignty, citizens protect their identity and businesses preserve their integrity.
Whatever the issue, IN Groupe, a company for digital sovereignty, contributes to asserting a fundamental right for everyone: the right to be you.

Based in Paris, the IN Groupe has two production centers and employs more than 1000 employees, of which over a third is dedicated to technology development.

Contact: IN Groupe

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@ingroupe.com

Five countries in West Africa select SPS solutions for their national eID cards

November 20, 2018

Smart Packaging Solutions (SPS), one of the world leaders in reliable and sustainable ID card and ePassport manufacturing technologies, is proud to announce its solutions have been selected by five countries in West Africa for their national eID cards as part of the ECOWAS (Economic Community of West African States) document standardization project.

ROUSSET, FRANCE, November 20, 2018 – SPS technology selection for these five countries demonstrates the company’s products are fully compliant not only with the ECOWAS international standard, but also able to fulfill specific demands from each government.

The international ECOWAS biometric ID card project standardizes a new generation of eID documents to facilitate the movements of the 350 million citizens of the 15 countries constituting the ECOWAS zone. The ECOWAS biometric ID card aims at providing the maximum protection against fraud and identity theft while offering interoperability with the existing national systems.

The ECOWAS specification includes provisions for the card, data, format, color and manufacturing requirements. Among these characteristics is the ability to have a means of level 2 card authentication thanks to an “aluminum watermark” visible by transparency. SPS Customized Antenna Image, or CAI™, perfectly answers this demand. With SPS unique manufacturing process, based on EBoostID®, the antenna is designed on request, which allows including aluminum etched distinctive signs in it. Typically, an antenna distinctive sign can be a national symbol, an acronym, or a second embodiment of the national symbol already part of the marked module or the card surface. This level 2 security feature is highly appreciated by law enforcement officers to perform night control. It can be easily and instantly checked with a smartphone torch by any policeman in the field to make a quick and fast opinion on the identity card authenticity.

Complying with ECOWAS and national governments’ demands, SPS technology also includes its Customized Module Image, or CMI™, that consists in having a specific image engraved on the micromodule for each member state. This image typically represents the symbol of the ECOWAS region or, for each state, its coat of arms or another design decided by the government. This level 1 feature has been widely deployed for more than 10 years on various ID documents across Europe, Africa, America and Asia.

Working in cooperation with card manufacturers familiar with secure document printing, SPS provides them with full polycarbonate (PC) card inlay subsets, allowing them to have an integrated and efficient manufacturing process while delivering the highest quality cards to the governments. SPS delivers its subsets in two forms: S-Lam® where the antenna is totally laminated in polycarbonate or S-Fix® where it is prefixed within the PC layer structure. Also, in order to satisfy all manufacturers technical needs, SPS micromodules can be delivered in standard thickness or thin version on request to accommodate various card structures.

Dominique Charrie, ID Product Manager at SPS declares: “We are very proud to be the first supplier for ID card modules and antennas for the eID cards of five countries among ECOWAS members. This demonstrates our technology totally fulfills government requirements and is acknowledged by card manufacturers as the most cost-efficient and giving the best results.”

ECOWAS countries include Benin, Burkina Faso, Cape Verde, Cote d’Ivoire, the Gambia, Ghana, Guinea, Guinea Bissau, Liberia, Mali, Niger, Nigeria, Senegal, Sierra Leone and Togo.

IN Groupe and SPS will be exhibiting on booth RIV F 020 at Trustech, a major event for digital trust technologies taking place in Cannes, France, on November 27-29, 2018.

About Smart Packaging Solutions

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards.

With the SPS brand, IN Groupe opens its secure components technology to all card and document manufacturers.

Contact

Olivier BRUNET, Product & Marketing director, SPS, contactsps@s-p-s.com
Phone: +33 4 42 53 84 44

SPS is part of the IN Groupe.

Based in Paris, the IN Groupe has two production centers and employs more than 1000 employees, of which over a third is dedicated to technology development.

Contact: IN Groupe

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@ingroupe.com

SPS and Oasys combine their forces to deliver easy to implement embedding solutions to all dual interface card manufacturers

October 24, 2018

Following substantial joint development work, Smart Packaging Solutions (SPS), a major developer of smart card technologies, and Oasys Technologies UK, a leading smart card manufacturing tool vendor, are proud to announce an exciting new industrial solution for smart card production – making production of dual interface cards easier, faster, more accurate and more accessible to smart card manufacturers of all sizes.

ROUSSET, FRANCE, October 24, 2018 – Considering new dual interface cards manufacturing techniques should be made available to all smart card vendors, Smart Packaging Solutions (SPS) and Oasys Technologies UK are entering in a collaboration to offer to the market an always easier access to new technologies. Thanks to this collaboration, smart card manufacturers will benefit from Oasys offer combining the best-in-class production tools with the most innovative processes and SPS offer allowing to build contactless, hybrid and dual interface cards suitable for all applications (payment, identity, mass-transit, etc). The partnership between SPS and Oasys builds upon a long-standing collaboration has already seen many of these production tools delivered to smart card producers in Europe, Middle-East and Africa.

The Oasys machine range goes from semi-automatic for smaller volumes and budgets up to larger format fully automated solutions allowing smart card industrialists to integrate dual interface manufacturing technology into their process more easily than ever and at a lower processing cost.

Now smart card vendors can benefit from the most advanced manufacturing technologies as Oasys introduces a new series of semi-automated production equipment, specially adapted to handle the SPS 40µm PET inlays, thus guaranteeing a quick setup and an optimal yield. This especially comes on time with the evolution of market demand with the ongoing migration to dual interface cards in the Americas, requiring more cards with colored S-Lams®, in order to satisfy specific marketing demands from card issuers.

Regarding the fully automated solutions, the process in the new machine (equipped with specific detectors) allows an accurate alignment between the different layers using the aluminum structure already in the inlay, thus eliminating the need for print marks – this provides maximum accuracy and for the first time eliminates the additional print processing and cost. A further key factor in the market is the growing use of colored S-Lams (inlays) which need equally accurately aligning in the card sheet assembly (collation). This process allows S-Lams of almost any color to be handled with similar yield, speed and flexibility.

Jean Baptiste Leos, Banking Product Manager at SPS declares: “With this combined solution with Oasys we bring an integrated solution to smart card manufacturers of all sizes, enabling them to integrate our process while getting the highest yields. Thanks to this joint offer smart card vendors will be innovative and remain competitive in conquering new markets.”

Paul Holloway, Sales Director at Oasys adds: “The combination of the unique SPS technology and a machine that allows easier and more cost-effective manufacture of their solution is a key step in the growth of dual interface technology and we look forward to helping our clients take advantage of this…”

SPS will be will be present at Smartcards expo trade show, October 30th, 31st & November 1st, 2018 at Pragathi Maidan, New Delhi on stand A 09. Come and visit us!

About SPS

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 140 people. Part of the French IN Groupe, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com

Phone: +33 4 42 53 84 44

SPS is part of the IN Groupe.

IN Groupe is a global leader in secure identity solutions and digital services.

Real engineering company, the IN Groupe is specialized in the integration of electronic and biometrics in identity documents and in polycarbonate cards. Thanks to its innovative new products and its strengthened security, the IN Groupe has become a worldwide leader with major customers in over 68 countries.

Based in Paris, the IN Groupe has two production centers and employs more than 900 employees, of which over a third is dedicated to technology development.

Contact: IN Groupe

Romain Galesne-Fontaine, Communication and Public Affairs Director, media@ingroupe.com

Phone : +33 1 40 58 30 00

About Oasys

Oasys is a leading designer and manufacturer of highly innovative plastic card production machines. With a heritage in the industry dating back to the late 70s it continues to provide a range of automated production systems for Banking, Smart, Dual interface and ID cards and EID products in over 60 countries and to many of the world’s leading Banking and Smartcard manufacturers.

In the area of Collation (gathering) Oasys has an unrivalled record of innovation and is considered a preeminent supplier of precision, automated collation systems in the global Banking and Smartcard industry.

Contact

Paul Holloway, Sales Director, paul.holloway@oasys.uk.com

Phone : +44 1767 600232

SPS offers new active anti-skimming security features for ePassports

October 18, 2018

Smart Packaging Solutions (SPS), introduces S-LOCK®, a new and active anti-skimming solution delivering additional security for citizen passport data.

ROUSSET, FRANCE, October 18, 2018 – With the increasing deployment of electronic passports all over the world, governments are under pressure to deliver ID documents that protect their citizens’ biometric data in their day-to-day life.

One of the main fears of citizens is to have their biometric data stolen without their knowledge – the hacking of private passport data right in your pocket!

Smart Packaging Solutions (SPS) has taken into consideration both governments and citizen expectations and is proud to introduce S-Lock® (a patented solution) for electronic passports. S-Lock® is an innovative and active jamming device designed to protect citizens’ secure data from hacking through RFID waves.

The SPS R&D team are specialists in designing solutions to activate or “boost” radio signals. For this product, however, they have used their knowledge in inductive coupling to create a solution, which "scrambles” the electromagnetic signal when a passport is closed. This is an ‘active solution’ making it inherently more efficient than any shield or ‘passive solution’.

S-Lock® solution can be added as an option for any passport inlay. S-Lock® device is based on the same material as SPS standard e-Boost antenna, with the same performance reliability. This solution has already been adopted by a major country government and volume deployment is ongoing. With this device, SPS widens its offer on its eBoost PASS® product line. SPS has already delivered passport inlays for more than ten counties, such as the Philippines, Algeria, France, Peru, Uruguay, Benin, Djibouti, ...

The S-Lock® device can also be combined with SPS patented and unique security features:

Customized Module Image(CMI®) for security level II.
Customized Antenna Image (CAI®) for security level II.

IN Groupe will be exhibiting on Stand 9 at the Fourteenth Symposium and Exhibition on the ICAO Traveller Identification Programme (TRIP), taking place in Montreal, Canada, on 23 - 25 October 2018. Come and visit us!

About SPS
Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 140 people. Part of the French IN Groupe, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies.

Contact
Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com

Phone: +33 4 42 53 84 44

SPS is part of the IN Groupe.

The IN Groupe is a global leader in secure identity solutions.
In a mobile and digital world where data security has become the major issue, the IN Groupe offers States, governments and businesses trusted solutions including added value electronic components for banking, identity solutions including electronic components, cutting-edge secure credentials and safe and reliable interoperable systems, but also innovative and efficient digital services, and secure solutions for complex printings and workflows.
Real engineering company, the IN Groupe is specialized in the integration of electronic and biometrics in identity documents and in polycarbonate cards. Thanks to its innovative new products and its strengthened security, the IN Groupe has become a worldwide leader with major customers in over 68 countries.

Based in Paris, the IN Groupe has two production centers and employs more than 900 employees, of which over a third is dedicated to technology development.

IN Groupe, through its subsidiary SPS, achieves 500 million inductive coupling platforms, a demonstration of the quality and security of its technology

June 21, 2018

Smart Packaging Solutions (SPS), a world leader in contactless and dual interface card manufacturing technologies, is proud to announce it has delivered its 500 millionth inductive coupling platform building upon the quality and reliability of technology delivering ultimate customer satisfaction.

ROUSSET, FRANCE, June 21, 2018 – Smart Packaging Solutions (SPS) is recognized as a worldwide leader in subsets for smart card manufacturing thanks to its inductive coupling technology. With a production capacity that doubles every two years, the company has now delivered over 500 million eBoost® inductive coupling platforms for diverse markets segments worldwide.

Smart Packaging Solutions (SPS) started with a strong belief that inductive coupling was bringing definite advantages to the smart card market. In 2007, the first organization to deploy inductive coupling technology for a national application was the government of Morocco for its national ID card. Now in 2018, cards are still on the field and new ID cards are issued every day to Moroccan citizens.

Now, thanks to years of permanent R&D leading to an always-improved level of quality and security, SPS eBoost® inductive coupling technology is widely adopted across all segments: payment, identity for cards and passports as well as mass-transit. All types of documents can benefit from the advantages of the technology: contact cards, contactless cards, hybrid (contact and contactless with two chips) and dual interface (single chip contact and contactless). Inductive coupling technology is qualified for a variety of materials: PVC, PET and PC (polycarbonate).

As a result of SPS continuous innovation, inductive coupling is recognized as a market standard. The technology is widely adopted to build dual interface payment cards. A decisive migration movement is happening in the Americas as payment networks and financial institutions have decided to distribute dual interface cards on a massive scale to their cardholders. SPS inductive coupling brings its decisive advantages of quality and security to support card vendors in tackling this highly attractive market.

SPS eBoost® inductive coupling is adopted by numerous card manufacturers worldwide as it allows them to evolve easily from contact cards to dual interface, hybrid and contactless cards while keeping the same equipment and the same process. High yields and insignificant return rates ensure that the whole process is extremely cost-effective and brings a high level of satisfaction for the issuers.

SPS inductive coupling is compatible with all chips and operating systems delivered by leading manufacturers for the smart card industry. SPS supports card manufacturers at all steps, from the selection process for card bodies and modules all the way to onsite support and precertification.

Didier Trutt, Chairman & CEO of IN Groupe declares: “The fact we have delivered 500 million eBoost® inductive coupling platforms is a recognition of SPS innovative technology and its customer focus for all market segments: identity, payment and mass-transit.”

IN Groupe / Smart Packaging Solutions (SPS) will be exhibiting on booth B14 (3rd floor) at SDW, a world-leading event providing a global showcase for next-generation human identity solutions, taking place at the QEII Centre, London, UK , on June 25-27, 2018. Come and visit us!
As a part of the event, Joachim Caillosse, Product Manager – ID and Travel Documents, IN Groupe, will deliver a speech at 11.30am on Wednesday 27 June, titled “Fraud on polycarbonate documents: Trends and technical answers from a manufacturer.”

About SPS
Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 140 people. Part of the French IN Groupe, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com
Contact
Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com

Phone: +33 4 42 53 84 44

SPS is part of IN Groupe.

The IN Groupe is a global leader in secure identity solutions.
In a mobile and digital world where data security has become the major issue, the IN Groupe offers States, governments and businesses trusted solutions including added value electronic components for banking, identity solutions including electronic components, cutting-edge secure credentials and safe and reliable interoperable systems, but also innovative and efficient digital services, and secure solutions for complex printings and workflows.
Real engineering company, the IN Groupe is specialized in the integration of electronic and biometrics in identity documents and in polycarbonate cards. Thanks to its innovative new products and its strengthened security, the IN Groupe has become a worldwide leader with major customers in over 68 countries.
Based in Paris, the IN Groupe has two production centers and employs more than 900 employees, of which over a third is dedicated to technology development.
Follow us on:

Contact: IN Groupe
Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@ingroupe.com

Already 50 million cardholders worldwide enjoy the benefits of SPS Dual 6 banking cards and ID documents

May 28, 2018

Smart Packaging Solutions (SPS), a world leader in contactless and dual interface card manufacturing technologies, is proud to announce that its “Dual6” micromodule technology is now adopted by numerous issuers worldwide for their banking cards leading to the deployment of more than 50 million units in the hands of cardholders.

ROUSSET, FRANCE, May 28, 2018 – Specially developed by SPS having in mind the needs for smart card vendors operating on highly competitive markets, the Dual 6 micromodules allow them to integrate easily dual interface cards in their product offer. Dual 6 micromodules are based on SPS eBooster® technology allowing to manufacture dual interface cards, that operate in contact and contactless modes, thanks to electromagnetic coupling between the antenna and the module (no physical connection between the chip and the antenna).

SPS Dual 6 micromodules have exactly the same dimensions and physical characteristics as regular contact micromodules. This way, smart card manufacturers can seamlessly expand their offer to dual interface cards without having to invest in costly new manufacturing tools. In addition, they gain in flexibility as they can produce batches of contact cards and dual interface cards on the same equipment, without any modification.

This way, smart card vendors that choose SPS Dual 6 micromodules are in the best position to support financial institutions worldwide in their evolution from contact cards to dual interface cards. Especially card issuers in Russia, the CIS and North as well as Latin America are in the process of switching massively from contact cards to dual interface cards.

As the dimensions of SPS Dual 6 are exactly the same as the dimensions of traditional contact micromodules, technical departments at banks can propose contactless payment as a new technology feature without having to require their marketing departments to change artworks, which may be costly given the variety of offers at banks nowadays.

In addition, Dual 6 micromodules are compatible with all features needed by issuers to offer their customers a full range of cards. Dual 6 micromodules can be embedded in colored core cards thanks to pre-laminated antennas available in different colors developed by SPS; they are also compatible with metallic and non-metallic foils that allow a wide variety of designs for high-end cards.

SPS Dual 6 micromodule is certified by Visa, MasterCard, Amex and Discover with semiconductors coming from all leading providers of chips for banking cards. SPS has obtained multiple LoAs (Letter of Approval) for combinations of its Dual 6 micromodules with various semiconductors and various operating systems.

Olivier Brunet, Product & Marketing director, SPS declares: “The fact that already 50 million cards based on our Dual 6 micromodules are on the field worldwide is the best proof the flexibility provided by our technology is praised by smart card vendors and allows them to be totally reactive to the variety of requirements coming from financial institutions.”

Smart Packaging Solutions (SPS) will be exhibiting at International PLUS Forum, a major event
for the secure transactions industry, taking place in Moscow, Exhibition and Convention
Centre "Sokolniki", on May 30-31, 2018. Come and visit us!

About SPS
Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 140 people. Part of the French IN Groupe, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com

Contact
Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com

Phone: +33 4 42 53 84 44

SPS is part of the IN Groupe.

The IN Groupe is a global leader in secure identity solutions.

In a mobile and digital world where data security has become the major issue, the IN Groupe offers States, governments and businesses trusted solutions including added value electronic components for banking, identity solutions including electronic components, cutting-edge secure credentials and safe and reliable interoperable systems, but also innovative and efficient digital services, and secure solutions for complex
printings and workflows.
Real engineering company, the IN Groupe is specialized in the integration of electronic and biometrics in identity documents and in polycarbonate cards. Thanks to its innovative new products and its strengthened security, the IN Groupe has become a worldwide leader with major customers in over 68 countries.
Based in Paris, the IN Groupe has two production centers and employs more than 900 employees, of which over a third is dedicated to technology development.

Contact: IN Groupe
Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@ingroupe.com

SPS doubles its production capacity to cope with fast growing demand in payment and identity

April 12, 2018

Smart Packaging Solutions (SPS), a world leader in contactless and dual interface card manufacturing technologies, has doubled its production capacity between 2016 and 2018. Next step, that will be completed by 2020, consists in keeping on investing in order to double again the company production capacity, ensuring SPS customers will be able to stand issuer demand for cards and ID documents.

ROUSSET, FRANCE, April 12th, 2018 – Demand for contactless, dual interface cards and documents has never been growing so fast. A combination of factors leads smart card and passport manufacturers to prepare for an increasing demand in both the payment and identity segments. Smart Packaging Solutions (SPS) remains by their side to ensure they will keep on benefitting from the company’s unique technology and be able to propose the cards and ID documents needed by the market.

Smart Packaging Solutions (SPS) has already achieved the first step in its production capacity ramp-up plan. The company has invested in new production equipment and is improving its process flow with roll to roll operation to ensure the delivery of larger quantities while keeping with its established records in terms of reliability and customer service. At the same time, SPS is making its production organization evolve and proposing its products and services to its customers thanks to the combination of its own manufacturing plant in Rousset, France, with the ones of its network of qualified manufacturing partners in different geographies. The combination between in-house production with SPS worldwide network of qualified manufacturing partners also allows to improve contingency plans and ensure the supply of products to the card manufacturers will remain uninterrupted whatever the circumstances.

Philippe Patrice, SPS CEO declares: “Thanks to all actions we have achieved over the last two years, we are now reaching a 300 million units production capacity. Now, we are launching the second phase of the plan that will allow us to increase steadily our production capacity and to double it again by year 2020.”

The demand growth in the banking segment is fueled by the switch from contact cards to dual interface cards especially in the Americas region, triggered by a mandate issued by both Visa and Mastercard, and supported by card issuers who recognize the advantages of dual interface cards to boost their card-based transactions.

In the identity segment, demand is raising thanks to the deployment of major ID programs and the always-expanding number of countries adopting ePassports.

Smart Packaging Solutions (SPS) offer includes subparts including micromodules, antennas and pre-laminated products, for smart card manufacturers allowing them to produce contact, contactless, dual interface and hybrid cards as well as ePassports and datapages.

Smart Packaging Solutions (SPS) will be exhibiting at Seamless Middle East, a major event for the secure transactions industry, taking place in Dubai UAE,on April 15-16, 2018. Come and visit us!

About SPS

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 140 people. Part of the French Imprimerie Nationale Group, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at http://www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com

Phone: +33 4 42 53 84 44

SPS is part of the Imprimerie Nationale Group

The Imprimerie Nationale Group is a global leader in secure identity solutions.

In a mobile and digital world where data security has become the major issue, the Imprimerie Nationale Group offers States, governments and businesses trusted solutions including added value electronic components for banking, identity solutions including electronic components, cutting-edge secure credentials and safe and reliable interoperable systems, but also innovative and efficient digital services, and secure solutions for complex printings and workflows.

Real engineering company, the Imprimerie Nationale Group is specialized in the integration of electronic and biometrics in identity documents and in polycarbonate cards. Thanks to its innovative new products and its strengthened security, the Imprimerie Nationale Group has become a worldwide leader with major customers in over 68 countries.

Based in Paris, the Imprimerie Nationale Group has two production centers and employs more than 900 employees, of which over a third is dedicated to technology development.

Contact: Imprimerie Nationale Group

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@imprimerienationale.fr

SPS offers different technologies for a seamless migration to dual interface payment cards in the Americas

March 21, 2018

Smart Packaging Solutions (SPS), a world leader in contactless and dual interface card manufacturing technologies, combines its Dual 6 micro-module with Colored Core and Foil technologies to allow US card manufacturers and issuers to benefit from the advantages of its eBoost PAY® technology and tackle seamlessly the migration from contact to dual interface cards.

ROUSSET, FRANCE, March 20, 2018 – On the mature and always-evolving payment card market, American issuers have deployed complex marketing strategies in their credit, debit and prepaid card portfolios leading them to propose cards with multiple features to their customers. Besides technical capabilities, numerous cards include physical and graphical elements including colored plastic layers in the core of the card or metallic designs on the card surface. In addition, many of these payment cards require up to 5 lines of embossing.

Today, many financial institutions in the Americas are migrating from contact to dual interface cards in order to provide their customers with the combination of the security brought by EMV contact cards with the ease of use of contactless transactions. Now, SPS brings to the industry all the needed technologies to ensure a smooth and massive migration.

SPS products give card manufacturers and issuers options to respond to their needs for credit, debit and prepaid cards:

· SPS Dual 6 micro-module has exactly the same dimensions as a regular contact-only module allowing an easy evolution from contact to dual interface cards without changing the artwork. Dual 6 micro-module easily replaces the standard contact micro-module with no need to modify the manufacturing process or equipment,

· SPS antennas for Dual 6 micro-modules are available and compatible with metallic and non-metallic Foils that allow a wide variety of text and designs in metallic inks on high end cards,

· SPS pre-laminated antennas are now available in different colors. They allow the manufacturer to produce colored core cards without showing the antenna on the edge. It brings additional physical security and a strong means of market differentiation.

These three technologies are using the SPS exclusive eBoost PAY® technology based on electromagnetic coupling between the antenna and the module (no physical connection between the chip and the antenna). SPS eBoost PAY® ensures the cards are significantly more reliable than cards manufactured with other technologies.

SPS eBoost PAY® technology is certified by major brands, Visa, MasterCard, Amex and Discover and supports all payment-dedicated chips and OS (Operating System) delivered by major suppliers. Thanks to their ID-1 antenna especially designed for banking cards, dual interface cards also reach a higher level of RF performance. In addition, integration in the supply chain is made easy as adding SPS Foil-compatible antennas and SPS Colored Core to an existing card production usually does not require a new LOA (Letter of Approval) nor a new certification.

Benoit Guez, VP Americas at SPS, declares: “As SPS proposes the combination of its Dual 6 micro-module with Colored Core and Foil compatible antennas, North and South American card vendors are able to provide financial institutions with all the needed cards for them to deploy their sophisticated marketing strategies while using the most reliable and cost-efficient technology on the market.”

SPS eBoost PAY® technology is already present in more than 500 million EMV cards on the field. The company has doubled its production capacity every year and has reached more than 70 LOA (Letter of Approval) in 2018; SPS eBoost PAY® technology is already certified by Visa, MasterCard, Amex and Discover and supports all payment-dedicated chips delivered by major semiconductor manufacturers.

Smart Packaging Solutions (SPS) will be exhibiting on booth 505 at ICMA Card Manufacturing & Personalization EXPO that will take place March 26-29, 2018, at the Omni Orlando Resort at Champions Gate in Florida. In addition, Benoit Guez, VP Americas at SPS will give a speech titled “Business, Marketing and Operational Challenges to Perform a Smooth Migration from EMV Contact to Dual Interface Cards” at ICMA EXPO, on Thursday March 25, 2018 at 10:45am in National Ballroom A.

About SPS

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 140 people. Part of the French Imprimerie Nationale Group, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com
Phone: +33 4 42 53 84 44

SPS is part of the Imprimerie Nationale Group

The Imprimerie Nationale Group is a global leader in secure identity solutions.

Based in Paris, the Imprimerie Nationale Group has two production centers and employs more than 900 employees, of which over a third is dedicated to technology development.

Contact: Imprimerie Nationale Group

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@imprimerienationale.fr

With SPS “Dual 6” module, smart card manufacturers are ready to deliver billion cards needed for the upcoming migration to dual interface cards in the Americas

November 23, 2017

Smart Packaging Solutions (SPS) “Dual 6” module and “S-Lams®” are now in full steam production allowing smart card manufacturers to integrate them seamlessly in their production process, in order to sustain the fast upcoming adoption of dual interface cards for the North and Latin America markets.

ROUSSET, FRANCE, November 22, 2017 – Smart Packaging Solutions, a world leader in contactless and dual interface card manufacturing technologies, is proud to announce its “Dual 6” and “S-Lams®” technologies are ready for integration for smart card manufacturers to benefit from the massive upcoming migration to dual interface cards in the Americas.

Already, leading financial institutions in the United States are showing interest for dual interface payment cards and plan to introduce them in 2018 in order to bring their customers the combination of the advantages of contactless cards with those of contact cards, all under the control of a single chip. Similarly, in the Latin America market, major payment brands are pushing financial institutions to issue dual interface cards from 2018 onwards.

SPS eBoost PAY® technology is already present in more than 250 million of EMV cards on the field. The company has doubled its production capacity every year and has reached more than 70 LOA (Letter of Approval) in 2017; SPS eBoost PAY® technology is already certified by Visa and MasterCard and supports all payment-dedicated chips delivered by major semiconductor manufacturers.

For financial institutions, the fact the Dual 6 micro-module has exactly the same dimensions as a regular contact-only module allows to evolve seamlessly from contact cards to dual interface cards, without having to modify the card artwork.

Based on electromagnetic coupling between the antenna and the module (no physical connection between the chip and the antenna), SPS eBoost PAY® ensures the cards are significantly more reliable than cards manufactured with other technologies. Thanks to ID-1 antenna especially designed for banking cards, dual interface cards also reach a higher RF level of performance with 5 lines of embossing on the cards.

For card manufacturers, the combination of Dual 6 and S-Lams® ensures a cost-effective offer diversification as the same equipment is used to manufacture contact cards and dual interface cards. These new production batches will be processed along the same methods and procedures, and on the same machines, as contact cards, adding flexibility and ensuring an extremely short time to market that will ensure card vendors will be able to satisfy the most demanding card issuers.

Combined with Dual 6, the S-Lams® inlay ensures an easy integration in the card manufacturing production flow. This process has been developed with automation in mind: as the antenna is etched on a rigid support that is laminated with the other layers to manufacture the plastic card, it can be easily handled by automated manufacturing equipment delivering optimized manufacturing costs associated with high yields in production.

Benoit Guez, VP Americas, at SPS, declares: “With our Dual 6 and S-Lam offer, we provide an not only unique and proved solution but also the best technology for card manufacturers to deliver the billions of dual interface cards needed for the migration to dual interface payment cards in North and Latin America.”

Smart Packaging Solutions (SPS) will be exhibiting on booth Riviera F 20 at Trustech Pay, Identify, Connect & Secure, an event focused on the entire payments and identification ecosystem, in the Palais des Festivals de Cannes, 28th to 30th November 2017.

About SPS

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 140 people. Part of the French Imprimerie Nationale Group, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS,

contact@s-p-s.com,
Phone: +33 4 42 53 84 44

SPS is part of the Imprimerie Nationale Group.

The Imprimerie Nationale Group is a global leader in secure identity solutions.

GroupeImprimerieNationale_Logo (002).png

Based in Paris, the Imprimerie Nationale Group has two production centers and employs more than 900 employees, of which over a third is dedicated to technology development.

Contact: Imprimerie Nationale Group

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@imprimerienationale.fr

SPS “Hybrid 8” module brings security and ease of management to ID documents

November 16, 2017

Smart Packaging Solutions (SPS) introduces Hybrid 8, a single-module process for hybrid cards that increases the ease of management of eID projects as well as their security while it streamlines the manufacturing process.

ROUSSET, FRANCE, 14th November 2017 – Smart Packaging Solutions, a world leader in eID documents, introduces “Hybrid 8,” its new module, for hybrid cards (including two chips: one contact and one contactless), an optimized solution that allows last-step embedding, easing the manufacturing process and delivering needs security thanks to simple and reliable processes.

With Hybrid 8 module, the manufacturing process for hybrid cards is considerably simplified, as the card manufacturer just needs to embed the module in the card body, in the exact same manner as when manufacturing a contact card. As the Hybrid 8 module has the same dimensions as a contact module, card vendors can use the same manufacturing equipment and the same procedures for all their production. To bring additional flexibility to card manufacturers, the Hybrid 8 module is available both in 470 µm and 550 µm thickness.

In addition, in order to bring always more security to ID document issuers, SPS Hybrid 8 module is compatible with the company's exclusive security features:

· Custom Antenna Image (CAITM), a watermark made on the antenna inside the card inlay, easy to control just with a strong light,

· Custom Module Image (CMITM), a logo on the module of a hybrid card.

As Hybrid 8 includes both the contact and the contactless chip, production management is made simpler, more efficient and less prone to errors: as the contact chip and the contactless chip are physically part of the same package there is no need for an additional operation to reconcile the serial number of the contact chip with the one of the contactless chip. Consequently, the creation of a White List including the serial numbers of the contact and contactless chips is made easier and more reliable as no additional operation is needed.

Having fewer subparts to assemble to produce a complete card inherently means a cost reduction for smart card manufacturers. Compared to traditional processes in which card vendors have to source the contact module and the contactless inlay from different suppliers, the simplification of the manufacturing process brought by SPS Hybrid 8 module leads to reducing the complexity of the supply chain allowing for reduced costs and shorter lead times.

The SPS Hybrid 8 module allows last-step embedding process: a card vendor manufactures finished printed card bodies, then runs quality acceptance procedures on them, often leading to reject up to 15% of these card bodies because of printing imperfections. With SPS last-step embedding process, cards are embedded with Hybrid 8 module only after these quality acceptance procedures are completed, which means no functional chips are rejected because of printing imperfections. This change in the manufacturing process not only increases the yield, but also drastically reduces the cost of rejects.

Olivier Brunet, Marketing and Product Director, at SPS, declares: “With SPS Hybrid 8 module, SPS keeps on delivering innovative means for card vendors to improve their offer. Hybrid 8 last-step embedding process brings additional security, better yields and a demonstrated cost-reduction for their manufacturing process.”

Smart Packaging Solutions (SPS) will be exhibiting on stand Riviera F 20 at Trustech Pay, Identify, Connect & Secure, an event focused on the entire payments and identification ecosystem, in the Palais des Festivals de Cannes, 28th to 30th November 2017.

About SPS

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 120 people. Part of the French Imprimerie Nationale Group, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS,

contact@s-p-s.com,
Phone: +33 4 42 53 84 44

SPS is part of the Imprimerie Nationale Group.

The Imprimerie Nationale Group is a global leader in secure identity solutions.

Based in Paris, the Imprimerie Nationale Group has two production centers and employs more than 900 employees, of which over a third is dedicated to technology development.

Contact: Imprimerie Nationale Group

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@imprimerienationale.fr

SPS new “Hybrid 8” module revolutionizes hybrid contact / contactless card embedding

June 26, 2017

As it has the exact same dimensions as a standard Dual 8 module,   Smart Packaging Solutions (SPS)   new    “Hybrid 8”   module facilitates the integration for card manufacturers,   which are now able to switch    seamlessly between contactless,   hybrid and dual interface card embedding.

ROUSSET,   FRANCE,   June 22,   2017 –   Smart Packaging Solutions,   a world leader in eID documents,    introduces “Hybrid 8,”   its new micro module,   for hybrid cards with two chips:   one contact and one    contactless.   The new Hybrid 8 module has exactly the same dimensions as SPS Dual 8 moduleused for dual    interface cards that support contactand contactless communication with a single chip.   This dimensional    standardization enables smart card manufacturers to switch easily betweenmanufacturing contactless,    hybrid and dual interface cards,   as no additional investment is needed.

The new Hybrid 8 module allows smart card manufacturers to integrate both the contact and the    contactless chip at the end of their process,    leading to a significantly better yield than the traditionalprocess in which the contactless chip has to be integrated in the form of an inlay,   before lamination and    printing,   which leads to poorer yields.

With the new Hybrid 8 module,   smart card manufacturers benefit froma simpler supply chain as they    receive the modules already embedded with both the contact and the contactless chips.   This way theyhave    a single supplier bringing a simpler and more reliable supply ofmodules,   already embedded with both    chips,   constituting a strategic supply.

Also,   with SPS “Module 8”,   as the smart card manufacturer completes the embedding of the module as the    last part of the process,   it is able tokeep inventories of cards and modules separately and complete the embedding and printing upon customers orders giving it the best flexibility and an efficient means to    deliver the best service to its customers.

The flexibility brought by the fact all modules “Hybrid 8“   and “Dual 8”   share the same footprint means that    smart card embedders can,   with a single process,   switch easily between manufacturing contact,   contactless    and dual interface cards.

SPS Hybrid 8 micro module is compatible with the company's exclusive security features:
• Custom Antenna Image (CAI TM ),   a watermark made on the antenna inside the card inlay,   easy to control
just with a strong light,
• Custom Module Image (CMI TM ),   a logo on the module of a hybrid card. Olivier Brunet,   Marketing and Product Director,   at SPS,   declares:

“SPS keeps on delivering innovative solutions to ensure smart card manufacturers benefit from its innovations providing them with improvedflexibility and boosting their yield and overall product quality.”

Smart Packaging Solutions (SPS)   will be exhibiting on stand B14 at SDW,   a    major conference and exhibition focusing on next-generation human
identity solutions and intrinsic document security,   in London,   on 26-28    June 2017.

About SPS
Smart Packaging Solutions is specialized in the design,   manufacturing and sale of contactless solutions    dedicated to ID cards,   e-passport and dual interface banking cards.   Headquartered in Rousset,   France,   with    a subsidiary in Singapore,   SPS employs 120 people.   Part of the French Imprimerie Nationale Group,   the    company specializes in contactlessand dual-interface products,   with a recognized micro packaging    expertise.   SPS has filed over 120 patents supporting its exclusive technologies.   More information at www.s-p-s.com

Contact
Olivier BRUNET,   Product &   Marketing director,   SPS,
contact@s-p-s.com,
Phone:   +33 4 42 53 84 44

SPS is part of the Imprimerie Nationale Group.

The Imprimerie Nationale Group is a global leader in secure identity solutions.
In a mobile and digital world where data security has become the majorissue,   the Imprimerie NationaleGroup offers States,   governments and businesses trusted solutions including added value electronic    components for banking,   identity solutions including electronic components,   cutting-edge securecredentials and safe and reliable interoperable systems,   but also innovative and efficient digital services,    and secure solutions for complex printings and workflows.
Real engineering company,   the Imprimerie Nationale Group is specialized in the integration of electronicand biometrics in identity documents and in polycarbonate cards.   Thanks to its innovative new products    and its strengthened security,   the Imprimerie Nationale Group has become aworldwide leader with majorcustomers in over 68 countries.
Based in Paris,   the Imprimerie Nationale Group has two production centers and employs more than 900 employees,   of which over a third is dedicated to technology development.

Contact:   Imprimerie Nationale Group
Romain Galesne-Fontaine         |           +33 1 40 58 30 00                 |                   media@imprimerienationale.fr

SPS new Dual 6 small-size dual interface micromodule for all payment schemes now supports Custom Module Image (CMI™)

March 6, 2017

Smart Packaging Solutions (SPS) introduces its new eBoost PAY® Dual 6 micromodule (6 pins size) dedicated to dual interface payment applications, which supports Custom Module Image (CMI™).

ROUSSET, FRANCE, March 6, 2017 – Smart Packaging Solutions, a world leader in dual interface banking and eID documents, introduces the latest version of its eBoost PAY® Dual 6 micromodule for dual interface banking cards that brings additional features and increased compatibility to the world of banking cards.

This latest version supports SPS exclusive Custom Module Image feature, which consists in engraving an image specific to the issuing financial institution on the module of the card. Now, with SPS new Dual 6 micromodule, all banks can make their brand image more prominent on the module on their dual interface cards.

SPS eBoost PAY® Dual 6 micromodule is certified by EMVCo, MasterCard and Visa as well as by most national payment schemes, making it a universal solution for financial institutions wishing to issue dual interface cards. SPS Dual 6 micromodule is compliant with Mastercard CQM, ISO 10443 and 7816 standards.

SPS Dual 6 micromodule is the same size as a regular 6-contact micromodule, such as the ones used for contact banking cards or SIM cards. For this reason, thanks to eBoost PAY® Dual 6, card manufacturers can easily switch from contact to dual interface cards, without any need for adapting the embedding machine on their manufacturing line.

With Dual 6 micromodule and thanks to SPS inductive coupling technology, smart card manufacturers benefit from economies of scale as they can have a general-purpose smart card manufacturing line that will produce all kind of 6-contact smart cards, bringing them the best flexibility and production chain efficiency to answer card issuers’ demands.

Stéphane Semori, Product Manager for Banking, at SPS, declares: “The new version of eBoost PAY® Dual 6 micromodule is even more universal as it allows financial institutions to boost their brand image with their logo on the module for all dual interface cards, regardless whether they belong to an international or a national scheme. Especially in US market, the new SPS eBoost PAY® Dual 6 micromodule participates actively to a frictionless migration from 6 pins contact to 6 pins dual interface cards.”

The new eBoost PAY® Dual 6 micromodule is already available in either gold or silver plating, and can be customized with any bank logo.

SPS will be exhibiting on booth 41, at Seamless South Africa, March 14-15, 2017 in Cape Town, South Africa.

SPS new eBoost PAY® Dual 6 micromodule

About SPS

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 120 people. Part of the French Imprimerie Nationale Group, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS,

contact@s-p-s.com,
Phone: +33 4 42 53 84 44

SPS is part of the Imprimerie Nationale Group

The Imprimerie Nationale Group is a global leader in secure identity solutions.

Based in Paris, the Imprimerie Nationale Group has two production centers and employs more than 700 employees, of which over a third is dedicated to technology development.

Contact : Imprimerie Nationale Group

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@imprimerienationale.fr

SPS thinnest inlay brings additional security features to passport polycarbonate datapage

November 24, 2016

Smart Packaging Solutions (SPS) introduces one of the thinnest inlay in the world that expands into the hinge of a passport bringing new security features thanks to its ability to embed a specific image for each government while making the assembly easier for passport manufacturers.

ROUSSET, FRANCE, November 24, 2016 – Smart Packaging Solutions, a world leader in dual interface and contactless eID documents and banking cards, introduces its hinge inlay for polycarbonate datapage in traditional and ePassports. As this patented technology combines the inlay for the datapage with the hinge of the passport, it allows to combine better security with a simplification of the manufacturing process.

The hinge inlay can embark a Customized Hinge Image (CHI™), a technology consisting in defining a specific hinge design for each passport issuer. For instance, a national symbol, an acronym or a specific mark can be part of the hinge design making it extremely difficult for a fraudster to reproduce. When the passport is controlled, a CHI™ can easily be verified by transparency, just by exposing the card in front of a light, like a watermark in a paper.

In addition, as the hinge inlay is extremely thin, under 40 µm, its lamination with the other layers in a passport datapage gives a thinner datapage. For instance, thanks to SPS hinge inlay thinness, the whole datapage of a non-electronic passport is only 400 µm while the datapage of an electronic passport is between 650 and 800 µm depending on the security features.

Finally, in case of an ePassport, the hinge inlay already includes the antenna, which is coupled with the chip by induction thanks to SPS EBooster® technology. This way, passport manufacturers see their assembly operations streamlined and more efficient while making ePassports more reliable. SPS hinge inlay can also be combined with all other security features.

Dominique Charrie, Product & Marketing manager for eID, declares: “The hinge inlay brings at the same time a higher security and a thinner datapage to passport designers and manufacturers. It allows them to streamline their process and gain in efficiency and product reliability”.

SPS will be present at Trustech, in Cannes, France, from November 29th to December 1st, 2016. Come and visit us on Groupe Imprimerie Nationale / SPS booth Riviera B059. In addition, the hinge inlay has been selected as a finalist through Nautilus™ datapage from Imprimerie Nationale, for the Sesames awards that will be announced during Trustech event.

About SPS

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 120 people. Part of the French Imprimerie Nationale Group, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com,
tel: +33 4 42 53 84 44

SPS is part of the Imprimerie Nationale Group.

The Imprimerie Nationale Group is a global leader in secure identity solutions.

Based in Paris, the Imprimerie Nationale Group has two production centers and employs more than 700 employees, of which over a third is dedicated to technology development.

Contact : Imprimerie Nationale Group

Romain Galesne-Fontaine | +33 1 40 58 30 00 | media@imprimerienationale.fr

SPS Validates ITW Brand Identity Division’s HoloLam Plus® for Dual Interface Transaction Cards

June 7, 2016

Following extensive testing performed by Smart Packaging Solutions’ (SPS) R&D Lab, ITW Brand Identity Division is proud to announce that its Premium and Advantage HoloLam Plus® full-face metallic and holographic laminates deliver EMV-like performance with dual interface transaction cards.

Chicago Heights, IL, USA and Rousset, France (PRWEB) June 06, 2016

Following extensive testing performed by Smart Packaging Solutions’ (SPS) R&D Lab, ITW Brand Identity Division is proud to announce that its Premium and Advantage HoloLam Plus® full-face metallic and holographic laminates deliver EMV-like performance with dual interface transaction cards. Because HoloLam Plus laminates do not interfere with the RFID signal, banks are able to create eye-catching, top-of-wallet card designs while utilizing the latest card technology.

SPS test results show that when used in conjunction with SPS’s eBoost PAY® solution, Premium and Advantage HoloLam Plus laminates provide the same RF performance as cards that do not contain foil. Advantage HoloLam Plus also eliminates electrostatic discharge (ESD).

HoloLam Plus

HoloLam Plus full-face laminates are used to create some of the world’s most distinctive cards and can also be used to build in a variety of security features. Available in standard metallized and holographic diffraction patterns as well as custom designs, HoloLam Plus laminates are process-friendly, print-receptive, and engineered to meet or exceed ISO/IEC 7810 peel strength for secure and non-secure transaction cards.

About SPS

Part of the French group Imprimerie Nationale, SPS is a world leader in dual interface banking and e-ID documents. SPS brings value to its customers by pre-certifying the performance of cards using its technology and guaranteeing card functionality in the field. For more information regarding SPS solutions, contact Stephane Semori, Product Manager Banking, at +33 (0)4 42 53 84 51 or stephane.semori(at)s-p-s(dot)com.

About ITW Brand Identity Division

A division of Illinois Tool Works Inc. (ITW), a Fortune 200 company, ITW Brand Identity Division has amassed vast experience in the development, design, and manufacture of a wide array of unique films, foils, holography, laminates, and transfers. Utilizing our proprietary technology, printing, engineering, and industry expertise, we deliver innovative, value-added products and solutions for the architectural, appliance and household goods, containers, cosmetics and personal care, medical, transaction card, and transportation parts and accessories markets. Our hot stamp foils and heat transfer films are used to mark and decorate a wide range of products, including vinyl siding, IV bags, automotive sun visors, credit cards, and cosmetic containers just to name a few. To learn more, visit http://www.itwbi.com.

About Illinois Tool Works Inc. (ITW)

ITW (NYSE: ITW) is a Fortune 200 global multi-industrial manufacturing leader with revenues totaling $13.4 billion in 2015. The Company’s seven industry-leading segments leverage the unique ITW Business Model to drive solid growth with best-in-class margins and returns in markets in which highly innovative, customer-focused solutions are required. ITW has nearly 50,000 dedicated colleagues in operations around the world who thrive in the company’s unique, decentralized and entrepreneurial culture. To learn more about the company and the ITW Business Model, visit http://www.itw.com.

SPS customized security features are now adopted by over 10 government authorities

May 23, 2016

Smart Packaging Solutions (SPS) exclusive customized security features: CMI™ (Custom Module Image), CAI™ (Custom Antenna Image) and CHI™ (Custom Hinge Image), are now adopted by more than 10 governments as they bring easy-to-control anticounterfeiting features for all types of identity documents: ePassports, ID cards, driving licenses, etc.

ROUSSET, FRANCE, May 23, 2016 – Smart Packaging Solutions, a world leader in dual interface eID documents and banking, is proud to announce its exclusive developments meet a growing market success. SPS has developed a series of customized security features, CMI™, CAI™ and CHI™ that are built in the structure of the document itself and are at the same time extremely easy to control for any law enforcement officer and almost impossible to counterfeit.

Now, over ten governments including France, Nigeria, Peru, and Gabon, among others have adopted SPS customized security features, allowing them to show a consistent image between all types of ID documents they issue. Thanks to SPS customized security features, any law enforcement officer is able to visually control the presence of the government signs in the document without needing any dedicated equipment nor extensive training.

Dominique Charrié, product manager Identity for SPS declares: “our customized security features apply to any type of document: ID cards, passports inlays, passport datapages, etc. This way governments can build a strong image by including their traditional coat of arms, for instance, in the most modern identity documents.”

Custom Module Image (CMI™) consists in engraving an image specific to the issuing authority on the module of the card or passport. Typically, a government may choose to have its flag, coat of arms or any symbol on its modules.

Custom Antenna Image (CAI™) allows to design a specific antenna for contactless or dual interface cards and documents that includes distinctive signs. A national symbol, an acronym, or a second embodiment of the national symbol already part of the marked module or the card surface can be used as a distinctive sign. These signs can easily be controlled by transparency, just by exposing the card in front of a light, like a watermark in a paper.

Custom Hinge Image (CHI™) applies the same principles to the hinge of an ePassport booklet. The hinge of the passport booklet includes a specific image, such as the issuing state coat of arms, flag or any other symbol. This hinge image can visually be checked by any officer.

To control these distinctive signs, a law enforcement officer needs only to have the knowledge of the presence of the sign, and just to be equipped with a light, such as a mobile phone torch.

SPS has published a detailed White Paper titled “Marked modules and antennas: physical security features for government ID cards,” which is available for download at http://www.s-p-s.com/white-paper/

SPS will be present at ID4 Africa 2016 which will take place in the Kigali Serena Hotel, in Kigali, Rwanda on the 24th-26th May 2016. We are pleased to invite you to come and visit us at our Stand n° B13

About SPS

Smart Packaging Solutions is specialized in the design, manufacturing and sale of contactless solutions dedicated to ID cards, e-passport and dual interface banking cards. Headquartered in Rousset, France, with a subsidiary in Singapore, SPS employs 120 people. Part of the French Imprimerie Nationale Group, the company specializes in contactless and dual-interface products, with a recognized micro packaging expertise. SPS has filed over 120 patents supporting its exclusive technologies. More information at www.s-p-s.com

Contact

Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com,
tel: +33 4 42 53 84 44

SPS is part of the Imprimerie Nationale Group:

The Imprimerie Nationale Group is a global leader in secure identity solutions.

Based in Paris, the Imprimerie Nationale Group has two production centers and employs more than 800 employees, of which over a third is dedicated to technology development.

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SPS pioneers dual-interface card manufacturing with its 6-contact micromodule

November 10, 2015

ROUSSET, FRANCE, November 11, 2015 – Smart Packaging Solutions, a world leader in dual interface banking and eID documents, is expanding its offer with eBoost PAY® Dual 6, its latest development in terms of micromodule for dual interface cards.

SPS introduces PFlex, a new multilayer paper solution for ePassport inlays

November 9, 2015

ROUSSET, FRANCE, November 9, 2015 – Smart Packaging Solutions, a world leader in dual interface eID documents and payment cards, is introducing its latest development dedicated to ePassport manufacturers.

SPS introduces Sub-Lam® to support large-volume production of payment cards

November 3, 2015

ROUSSET, FRANCE, November 2, 2015 – Smart Packaging Solutions, a world leader in dual interface banking and eID documents, is expanding its offer with “Sub-Lam®,” a laminate built with an inlay and two PVC sheets dedicated to large volumes of dual interface payment cards.