ROUSSET, FRANCE, May 4, 2015 Smart Packaging Solutions (SPS) is proud to announce its new commercial organization in the Americas. Benoit Guez newly appointed as VP Americas will supervise all sales and marketing actions in North and South America.
Read MoreSPS reorganizes its offer along three product lines
ROUSSET, FRANCE, November 3, 2014 – Smart Packaging Solutions, a world leader in dual interface banking and eID documents, is happy to announce it is reorganizing its product offer along three product lines to better serve all the markets the company has been addressing for years.
Read MoreSPS increases its focus on ASPAC with the opening of its Singapore subsidiary
ROUSSET, FRANCE, October 29, 2014 – Smart Packaging Solutions, building upon its longstanding market presence in the Asia Pacific region, announces the opening of its subsidiary in Singapore.
Read MoreUnitec Blue partners with SPS to for Argentina, Paraguay and Uruguay markets
ROUSSET, FRANCE, and CHASCOMUS, ARGENTINA, May 12,2014 Smart Packaging Solutions has just engaged in a partnership with Unitec Blue,a leading chip and smart card manufacturer in Argentina.
Read MoreSPS EBooster ® obtains over 45 certifications demonstrating universal recognition by payment networks
ROUSSET, FRANCE, March 18, 2014 Smart Packaging Solutions (SPS) is proud to announce that its EBooster® technology has been certified by most international and national payment networks, thus demonstrating its versatility in terms of semiconductor suppliers, operating systems and smart card manufacturers.
Read MoreSmart Packaging Solutions (SPS) and CPI Card Group achieve a new step in dual interface card production and personalization
Rousset, FRANCE, and Denver, CO, USA, November 19, 2013,Smart Packaging Solutions (SPS), an expert in smart card technologies, and CPI Card Group, a leader in financial, EMV and Commercial payment solutions, are pleased to announce that high productivity and reliability for inline production and testing of dual interface cards for the financial market has been achieved.
Read MoreNIMC Nigeria includes identity and payment on the same card, thanks to NXP Semiconductors, MasterCard and SPS
ROUSSET, FRANCE November, 18 2013 NIMC Nigeria includes identity and payment
on the same card, thanks to NXP Semiconductors, MasterCard and SPS
Read MoreSPS expands its pre-personalization services offer
ROUSSET, FRANCE, October 15, 2013 - Smart Packaging Solutions is happy to announce the expansion of its pre-personalization offer with tools and procedures that allow smart card embedders to optimize their personalization machine usage.
Read MoreSPS offer now includes certified banking platform based on STMicroelectronics solution
ROUSSET, FRANCE, April 22, 2013 Smart Packaging Solutions announces the addition of STMicroelectronics solution dual interface certified platform to its banking card offer. This way,
SPS customers benefit from the cost advantage of SPS EBooster technology
and are able to satisfy a wider scope of demand from financial institutions.
Read MoreSPS and Infineon sign cross-licensing agreement
ROUSSET, FRANCE, February, 1st 2013 Smart Packaging Solutions (SPS) and Infineon Technologies AG just signed a cross licensing agreement covering their intellectual property for the “Inductive Coupling” technology.
Read MoreSPS settles down in Asia
ROUSSET, FRANCE, December 3, 2012 – As a means to improve its service to customers in the Asia Pacific area, and to support this booming market, Smart Packaging Solutions has appointed Alex Chung as Chief Representative Greater China & South East Asia and selected GSight as Exclusive Agent for China.
Read MoreSPS appoints ARE CON distributor for Central Europe
ROUSSET, FRANCE, October 29, 2012 – After years of commercial relations, ARE CON, a German company involved in distribution with a focus on the manufacturers and system integrators of smart cards, and Smart Packaging Solutions, an expert in secure contactless and dual interface solutions, have just set up a distribution agreement appointing ARE CON as SPS distributor for Germany, Austria and Switzerland.
Read MoreSPS appoints Sylvain Auchere as Sales Director France
ROUSSET, FRANCE, September 17, 2012 – In order to keep on developing its
activity, Smart Packaging Solutions is strengthening its commercial team, with
the addition of Sylvain Auchère, as Sales Director France.
Read MoreSPS Embedded Contactless Module is now available for volume shipments
ROUSSET, FRANCE, June11, 2012 - Smart Packaging Solutions’ Embedded Contactless Module is now available for mass production. This patent-protected technology from SPS allows Identity
Document producers to manufacture contactless smart cards the same way, and with the same equipment as contact cards, thus leading to better quality cards and higher yields.
Read MoreSPS and Bsmart partner for dual technology banking cards in Latin America
ROUSSET, FRANCE, May 7, 2012 - Smart Packaging Solutions is pleased to announce that Bsmart, a Brazilian company involved in secure transaction markets, has been appointed as its Agent for the Latin America and Caribbean area.
Read MoreSPS brings reliable dual technology for China smart card migration
ROUSSET, FRANCE, March 26, 2012 – Smart Packaging Solutions is ready for China migration to smart (Chip and PIN) banking cards. The Chinese Government, along with PBOC (People’s Bank of China) already confirmed all banking cards in China would use smart card technologies by 2015.
Read MoreSPS makes banking card integration easier with 15 Visa and MasterCard certifications in 2011
ROUSSET, FRANCE, March 5, 2012 - Smart Packaging Solutions expertise in dual-interface has been recognized again with 15 additional Visa and MasterCard certifications obtained in 2011. Thanks to SPS technology, smart card manufacturers are ideally positioned to deliver payment cards worldwide and especially to benefit from the EMV migration in North America.
Read MoreSPS wins a Sesames 2011 award
ROUSSET, FRANCE, Tuesday 15th November 2011 - Embedded Contactless Module - Smart Packaging Solutions
SPS embedded contactless module is an alternative manufacturing process to the “traditional way” based on inlay technology.
Read MoreContactless cards take over the smart card world with dual interface solution leading the way
London - 14 November 2011- The high degree of interconnection in the modern world drives the use of authentication technologies, which should not only be secure but also fast. Governments and other stake holders have increasingly adopted smart cards to manage a shift from security to convenience.
Read MoreSPS Ships its 20 Millionth Contact & Contactless EMV Platform
ROUSSET, FRANCE, Monday 7th November - Smart Packaging Solutions has already shipped 20 million of its E-Booster® dual interface platforms dedicated to dual-technology (contact & contactless) banking cards.
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